Recent Advances in Printed Chipless Passive Inductively Coupled LC-Based Telemetric Systems for Smart Products: A Scoping Review

Telemetric systems are particularly valuable in applications where remote data acquisition and automatic transmission allow effective monitoring of local characteristics. Among the different telemetric approaches, passive wireless systems based on inductive coupling are particularly attractive because they enable sensor interrogation without onboard power storage. Printed electronics (PE) offer several advantages in the realization of such systems, including a wide selection of functional materials, reduced production costs, possibility of rapid prototyping and complete customization. This allows for the development of smart products by embedding sensors and electronics directly into existing objects without significantly altering their geometry or weight. In light of this, the aim of this scoping review is to explore key factors in implementing chipless passive inductively coupled LC telemetric systems via PE. Given the growing interest in smart products, this scoping review serves as a starting point for the design and implementation of smart products specifically on printed passive inductively coupled LC telemetric systems, addressing their development. To better understand the identified solutions, we first outlined the requirements and characteristics of ideal chipless passive LC-based inductively coupled telemetric systems. Then, we provided a comprehensive analysis of conductive materials and substrates, manufacturing technologies, and the design and performance of printed inductors and associated readout architectures.